Thermal Silicone Pad ( No Fiberglass)

Thermal Silicone Pad
With high thermal conductivity, good insulation resistance and voltage resistance, this product can be stampinged and cut into insulation thermal pads according to any particular modal heating appliance.
Usage: used for circuit board to thermal press and conduct. It can replace some imported products, like FUJI. Typical Specification: 0.15T、0.18、0.2T、0.23T、0.3T、0.45T、0.8T、1.0、1.5T and so on.

 

http://www.gdrichone.com/pid176178/Thermal+Silicone+Pad+%28+No+Fiberglass%29.htm

Sil-pad K-6

TYPICAL PROPERTIES OF SIL-PAD K-6

PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD

Color	bluegreen	Bluegreen	Visual
Reinforcement Carrier	Kapton	Kapton	----
Thickness(inch) /(mm)	0.006	0.152	ASTM D374
Hardness (Shore A)	90	90	ASTM D2240
BreakingStrenght (ibs/inch) / (kN/m)	30	5	ASTM D1458
Elongation (%45°toWarp and Fill)	40	40	ASTM D412
Tensile Strength (psi) /(MPa)	5000	34	ASTM D412
Continuous Use Temp (℉) /（℃）	-76 to356	-60 to 180	-----
ELECTRICAL
Dielectric Breakdown Voltage(Vac)	6000	6000	ASTM D149
Dielectric Constant (1000 Hz)	4	4	ASTM D150
Volume Resistivity(Ohm-meter)	1012	1012	ASTM D257
Flame Rating	VTM-O	VTM-O	U.L94
THERMAL
Thermal Conductivity(W/m-K)	1.1	1.1	ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure(psi) 10 25 50 100 200
TO-220 Thermal Performance (℃/W) 3.24 3.03 2.76 2.45 2.24
Thermal Impedance (℃-in2/W)(1) 0.82 0.62 0.49 0.41 0.36

 

http://www.gdrichone.com/pid11342632/Sil-pad+K-6.htm

Thermal Silicone Pad ( No Fiberglass)

Thermal Silicone Pad
With high thermal conductivity, good insulation resistance and voltage resistance, this product can be stampinged and cut into insulation thermal pads according to any particular modal heating appliance.
Usage: used for circuit board to thermal press and conduct. It can replace some imported products, like FUJI. Typical Specification: 0.15T、0.18、0.2T、0.23T、0.3T、0.45T、0.8T、1.0、1.5T and so on.

 

http://www.gdrichone.com/pid176178/Thermal+Silicone+Pad+%28+No+Fiberglass%29.htm

Thermal Conductive Silicone Grease

It is white grease mixture of the organic silicon grease and stuffs with the property of thermal conductivity and insulation .
It is widely used as media of thermally conducting for electronic components such as between the CPU and heat-eliminating machine ,LED tubes with large power and alumiun,copper matetials ,in order to decrease the working temperature .
This product has the property of exellent insulation and thermal conductivity as well as low rate of grease ,convenience to use ,simple process of coating and sealing .The electronic components coated with this thermal silicon grease has good anti-wet ,anti-dust ,anti- erosion ,anti-shaking properties ,the thermal conductivity can be 0.8,1.4,1.8,3.5(w/m.k) respectivly which is available to different customers
The package for this product is 1kg and 5kg for each package respectively

REVERSE LOCKING CIRCUIT BOARD SUPPORT

Material:

NYLON 66 with UL certificate (Authentic color),

Flammability class:94V-2.

Usage:

First fasten the spacer support with the 5.5mm substrate drilling hole, then push the spacer from down to fasten.

 

http://www.gdrichone.com/pid151692/REVERSE+LOCKING+CIRCUIT+BOARD+SUPPORT.htm

TO-220 TO-3P TO-247 TO-3 MICA

Product Name :　MICA
Product Information:
Features： good mechanical strength and heat-resistance
operating temprature scope:within 600℃
usage ： widely used for metallurgy,chemical ,electronic products for the purpose of insulating 　
Typical model: TO-220、TO-3P1、TO-3P2、TO-3PL、TO-3
Notes: different models can be made at customer's request

 

http://www.gdrichone.com/pid9837/TO-220+TO-3P+TO-247+TO-3+MICA.htm