Thermal Silicone Pad
With high thermal conductivity, good insulation resistance and voltage resistance, this product can be stampinged and cut into insulation thermal pads according to any particular modal heating appliance.
Usage: used for circuit board to thermal press and conduct. It can replace some imported products, like FUJI. Typical Specification: 0.15T、0.18、0.2T、0.23T、0.3T、0.45T、0.8T、1.0、1.5T and so on.
With high thermal conductivity, good insulation resistance and voltage resistance, this product can be stampinged and cut into insulation thermal pads according to any particular modal heating appliance.
Usage: used for circuit board to thermal press and conduct. It can replace some imported products, like FUJI. Typical Specification: 0.15T、0.18、0.2T、0.23T、0.3T、0.45T、0.8T、1.0、1.5T and so on.
http://www.gdrichone.com/pid176178/Thermal+Silicone+Pad+%28+No+Fiberglass%29.htm
