K10 K6 K4 Silicone PAD

Silicone PAD K4 & Silicone PAD K6 is bonded by Dupont Kapton Mt film and Silicone PAD rubber.

Kapton is for high stamping resistance and heat conducting.

SIL-PAD K10 is with the best property of thermal conducting in the film of Kapton structure.

This design is for replacing the brittle ceramic Beryllium Oxide.Boron Nitide and Alumina.

This ultrathin product is with good heat conducting, high temperature and high voltage resistance.

Usage: used to high temperature insulate for audion with high power, field-effect tube, stabilivolt module ( LM78 series, LM317 series, SANYO power source thick mould, source thick mould ), various TDA series, controllable silicon module with high power (Omron series ), integration rectification module and other electronic and heating components.

Typical specification: thickness 0.15mm (6 mill). Special thickness or nonstandard specification is also available by order.

 

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