Thermal Silicone Pad
With high thermal conductivity, good insulation resistance and voltage resistance, this product can be stampinged and cut into insulation thermal pads according to any particular modal heating appliance.
Usage: used for circuit board to thermal press and conduct. It can replace some imported products, like FUJI. Typical Specification: 0.15T、0.18、0.2T、0.23T、0.3T、0.45T、0.8T、1.0、1.5T and so on.
With high thermal conductivity, good insulation resistance and voltage resistance, this product can be stampinged and cut into insulation thermal pads according to any particular modal heating appliance.
Usage: used for circuit board to thermal press and conduct. It can replace some imported products, like FUJI. Typical Specification: 0.15T、0.18、0.2T、0.23T、0.3T、0.45T、0.8T、1.0、1.5T and so on.
http://www.gdrichone.com/pid176178/Thermal+Silicone+Pad+%28+No+Fiberglass%29.htm
Thermally Conductive Silicone Interface Pads are designed to provide a preferential heat-transfer path between heat-generating IC packaging and heat sinks or other cooling devices.
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